GLF71321

Ultra-Efficient, IQSmart™ Load Switch with Slew Rate Control

0.97mm x 1.47mm 
0.55mm thick
0.5mm pitch
6 bump
WLCSP

Features

  • Low RON : 15mΩ Typ @ 5.5VIN
  • Ultra-Low IQ: 3nA Typ @ 5.5VIN
  • Ultra-Low ISD: 45nA Typ @ 5.5VIN
  • IOUT Max: 4A @ 5.5VIN
  • Wide Input Range: 1.1V to 5.5V
  • 6V abs max
  • Controlled Rise Time: 400μs at 3.3VIN
  • Internal EN Pull-Down Resistor
  • Integrated Output Discharge Switch
  • Ultra-Small: 0.97mm x 1.47mm
  • Thin: 0.55mm typ, 0.6mm MAX

Applications

  • Wearables
  • Data Storage, SSD
  • Mobile Devices
  • Low Power Systems
  • Battery Powered Systems

PART SCHEMATIC

GLF 71311 schematic

APPLICATION SCHEMATIC

PRODUCT DESCRIPTION

The GLF71321 is an ultra-efficienct, 4A rated, Load Switch with integrated slew rate control. With a focus on Low RON, its best in class efficiency makes it an ideal choice for higher current applications. The GLF71321 is ideal for use in IoT, mobile, and wearable electronics.

The GLF71321 features ultra-efficient IQSmartTM technology that supports some of the lowest RON, quiescent currents (IQ) and shutdown currents (ISD) in the industry. Low RON reduces conduction losses, while low IQ and ISD solutions help designers to reduce parasitic leakage currents, improve system efficiency, and increase battery lifetimes.

The GLF71321 integrated slew rate control can also enhance system reliability by mitigating bus voltage swings during switching events. Where uncontrolled switches can generate high inrush currents that result in voltage droop and/or bus reset events, the GLF slew rate control specifically limits inrush currents during turn-on, helping to minimize voltage droop.

GLF71321 Load Switch devices support an industry leading wide input voltage range, helping to improve operating life and system robustness. Furthermore, one device can be used in multiple voltage rail applications, helping simplify inventory management and reduce purchasing, and operating costs.

GLF71321 Load Switch devices are small. They use chip scale packaging, utilizing 6 bumps, in a 0.97mm x 1.47mm die size with 0.5mm bump pitch.

Released

NOTE: Spec values & feature set for "Coming Soon" and "Development" devices are provided on a best estimate basis, based on available data at time of estimate. Values are subject to change. GLF makes no warrenties that it will release or offer for sale products that are marked “Coming Soon” or “Development” "Integrated Features" Table Key: √ = Feature Included, P = Programmable Feature

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