GLF74521

Ultra-Low Current Consumption Power Multiplexer Switch with Auto & Manual Input Selection

Features

Two-Input and Single-Output Power Multiplexer Switch

Automatic and Manual Input Selection Mode

Supply Voltage Range:1.5 V to 5.5 V 6V abs max

Ultra-Low Supply Current at Operation IQ :4 µA Typ. @ 5.5 VIN

Ultra-Low Stand-by Current ISD :20 nA Typ. @ 5.5VIN

RON :35mΩ Typ. @ 5.5 V IN1 or VIN2 ; 43mΩ Typ. @ 3.3 VIN1 or VIN2

2.5A Continuous Output Current Capability Per Channel

Smart Control Pins:IEN and ISEL: 3 nA Typ at VEN or VSEL > VIH ; REN and RSEL: 500 kΩ Typ

Integrated Output Discharge Switch

No Cross Conduction Between Two Inputs

Reverse Current Blocking when Disabled

Operating Temperature Range:-40 to 85 °C

HBM / CDM:6kV / 2kV

Description

The GLF74521 is an integrated power multiplexer switch with dual independent power switches connected to a single output pin to enable seamless transition between two input sources.

The GLF74521 provides an automatic selection mode as well as a manual selection mode by the combination of the logic input pins of EN and SEL. The EN input pin is used along with the select (SEL) input pin to select the automatic switching function, select VIN1 only, select VIN2 only, or turn both switches off. In the automatic selection mode, the GLF74521 automatically selects the higher input voltage source out of two input DC power supplies.

The GLF74521 features an ultra-efficient IQSmartTM technology that supports the lowest RON, quiescent current (IQ) and shutdown current (ISD) in the industry. Low RON reduces conduction losses, while low IQ and ISD solutions help designers to reduce parasitic leakage current, improve system efficiency, and increase battery lifetime.

The GLF74521 blocks any cross conduction current between two input sources. When the switch is disabled, the GLF74521 prevents the reverse current to the input source from the output at any higher Vout than Vin condition.

The GLF74521 utilizes chip scale package technology with 6 bumps in a 0.97 mm x 1.47 mm x 0.55 mm package size with a 0.5 mm bump pitch.

Package

CSP 0.97 x 1.47 x 0.55