The GLF Glossary

TERM DEFINITION
Load Switch

A load switch is like a relay, with no moving parts, that controls power to a load by powering it on and off.

LDO

A LDO is a cost effective way to regulate output voltage that is powered by a higher voltage input.

Low RON

Low On-Resistence value between the drain and the source of the relay during operation.

Low Quiescent Current

The current consumed by the Integrated Circuit when it is enabled, but there is no load and the device is not switiching.

On-Resistance (RON)

The resistence of a transistor when it is on.

Slew Rate Control

A function that limits the rate of change of voltage or current, controlling how fast a current can rise or fall. Preventing spikes.

Wide Input Voltage Range

A feature that allows a device to accept a wide range of inputs without damaging the circuit, used in envoronments with unstable power.

In-Rush Protection

A circuit that limits the initial surge of current when the device is powered on.

Reverse Current Protection

Prevents current from flowing backwards through a circuit which can damage sensitve components.

Reduce Voltage Drop

Decreases the amount of voltage loss in an electrical circuit.

Ultra-Efficiency

The load switch delivers superior efficiency, ensuring that power loss is minimized, which is vital in battery-powered devices where energy conservation is a top priority.

Integrated Slew Rate Control

This feature helps control the rise and fall of voltage when turning the switch on or off, minimizing the risk of voltage spikes or drops. This is especially important in sensitive electronics to protect components from electrical stress.

Ultra-efficient IQSmart™ technology

This technology is designed to keep the quiescent current (IQ) and shutdown current (ISD) as low as possible. These are key performance indicators for energy efficiency, especially in battery-powered systems.

Low IQ and ISD

The quiescent current (IQ) is the current the device consumes when it is active but not performing any tasks. The shutdown current (ISD) is the current consumed when the device is in a low-power or off state. Lower values for both help minimize energy drain.

Wafer Level Chip Scale Package (WLCSP)

This is a package type where the device is built directly on a silicon wafer, and the package is almost the same size as the die. This allows for a very small form factor, which is ideal for space-constrained applications.

Bump Pitch

The bump pitch refers to the center-to-center distance between the solder bumps used for connecting the device to the PCB. This small bump pitch enables a high density of connections in a small space, making the device suitable for compact, high-performance electronics.

PCM (Protection circuit module)

Integrated protection circuit simplifies the design, reduces component count, and minimizes space usage. Nano-current load switch with integrated reset timer, Built-in timing function for delayed shutdown and automatic recovery.

Power Multiplexer

A power multiplexer that allows seamless switching between multiple power sources.

Shipping Mode

Reduces Battery Leakage: most internal circuits and I/Os are shut down, significantly lowering standby current (typically <1 nA), helping preserve battery life. Extends shelf life: Ideal for the period between manufacturing and first-time use. Prevents accidental activation: protects the product from being unintentionally powered on during packaging or transport. Improves End-User experience: ensures users receive the product with a “fresh” battery status. Facilitates factory testing and logistics prevents battery drain or misoperation between final testing and shipment.

Output Discharge

Feature that actively discharges the output to GND when turned off.