GLF71301

Ultra-Small, IQSmart™ Load Switch with Slew Rate Control

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0.77mm x 0.77mm 
0.46mm thick
0.4mm pitch
4 bump
WLCSP

Features

  • Ultra-Small:    0.77mm x 0.77mm
  • Breakthrough RON :   34mΩ @ 5.5VIN
  • Ultra-Low IQ :   1nA Typ @ 5.5V
  • Ultra-Low ISD :   19nA Typ @ 5.5V
  • IOUT Max:   2A
  • Wide Input Range: 1.1V to 5.5V
    • 6 Vabs max
  • Controlled Rise Time: 430us at 3.3VIN
  • Internal EN Pull-Down Resistor & Active High
  • Integrated Output Discharge Switch

Applications

  • Wearables
  • Data Storage, SSD
  • Mobile Devices
  • Mobile Medical Devices
  • Power Efficient Systems
  • Battery Powered Systems

FUNCTIONAL BLOCK SCHEMATIC

GLF 71311 schematic

APPLICATION SCHEMATIC

GLF71301 Application Schematic

PRODUCT DESCRIPTION

The GLF71301 is an ultra-efficient, 2A rated, Load Switch with integrated slew rate control. At 0.77mm x 0.77mm its very small. At 34mΩ RON, it offers breakthrough efficiency that makes it an ideal choice for use in small form factor and efficient IoT, mobile, and wearable electronics.

The GLF71301 features ultra-efficient IQSmartTM technology that supports some of the lowest quiescent currents (IQ) and shutdown currents (ISD) in the industry. Low IQ and ISD solutions help designers to further reduce parasitic leakage currents, improve system efficiency, and increase battery lifetimes.

The GLF71301 integrated slew rate control can also enhance system reliability by mitigating bus voltage swings during switching events. Where uncontrolled switches can generate high inrush currents that result in voltage droop and/or bus reset events, the GLF slew rate control specifically limits inrush currents during turn-on, helping to minimize voltage droop.

GLF71301 Load Switch devices support an industry leading wide input voltage range, helping to improve operating life and system robustness. Furthermore, one device can be used in multiple voltage rail applications, helping simplify inventory management and reduce purchasing, and operating costs.

GLF71301 Load Switch devices are small. They use chip scale packaging, utilizing 4 bumps, in a 0.77mm x 0.77mm die size with 0.4mm bump pitch.

Released
117
AdobeStock_270328446_Preview

NOTE: Spec values & feature set for "Coming Soon" and "Development" devices are provided on a best estimate basis, based on available data at time of estimate. Values are subject to change. GLF makes no warrenties that it will release or offer for sale products that are marked “Coming Soon” or “Development” "Integrated Features" Table Key: √ = Feature Included, P = Programmable Feature

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